Thermomechanical analysis in electronic packaging with...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1998 Vol. 21; Iss. 1

Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints

Desai, C.S., Basaran, C., Dishongh, T., Prince, J.L.
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Volume:
21
Year:
1998
Language:
english
Pages:
11
DOI:
10.1109/96.659511
File:
PDF, 286 KB
english, 1998
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