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Self-Assembly and Self-Tiling: Integrating Active Dies Across Length Scales on Flexible Substrates
Knuesel, R.J., Sechul Park, Wei Zheng, Jacobs, H.O.Volume:
21
Year:
2012
Language:
english
Pages:
15
DOI:
10.1109/jmems.2011.2174424
File:
PDF, 2.03 MB
english, 2012