Electro-Thermal Analysis of In-Plane Micropump

IEEE Transactions on Components and Packaging Technologies 2010 Vol. 33; Iss. 2

Electro-Thermal Analysis of In-Plane Micropump

Karajgikar, S., Rao, S., Jeongsik Sin, Agonafer, D., Jung-Chih Chiao, Popa, D., Stephanou, H.
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Volume:
33
Year:
2010
Language:
english
Pages:
11
DOI:
10.1109/tcapt.2010.2040737
File:
PDF, 8.94 MB
english, 2010
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