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The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading
Mattila, T.T., Kivilahti, J.K.Volume:
33
Year:
2010
Language:
english
Pages:
7
DOI:
10.1109/tcapt.2010.2051268
File:
PDF, 7.52 MB
english, 2010