Solid State Bonding of Silicon Chips to Silver Buffer on...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 2

Solid State Bonding of Silicon Chips to Silver Buffer on Copper Substrates

Chu-Hsuan Sha, Lee, C.C.
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Volume:
2
Year:
2012
Language:
english
Pages:
5
DOI:
10.1109/tcpmt.2011.2161085
File:
PDF, 1.75 MB
english, 2012
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