Bandwidth Enhancement Based on Optimized Via Location for...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 2

Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes

Chuen-De Wang, Yi-Min Yu, de Paulis, F., Scogna, A.C., Orlandi, A., Yih-Peng Chiou, Tzong-Lin Wu
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Volume:
2
Year:
2012
Language:
english
Pages:
10
DOI:
10.1109/tcpmt.2011.2176339
File:
PDF, 2.39 MB
english, 2012
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