A three-dimensional stacked fin-CMOS technology for...

IEEE Transactions on Electron Devices 2005 Vol. 52; Iss. 9

A three-dimensional stacked fin-CMOS technology for high-density ULSI circuits

Xusheng Wu, Chan, P.C.H., Shengdong Zhang, Chuguang Feng, Chan, M.
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Volume:
52
Year:
2005
Language:
english
Pages:
6
DOI:
10.1109/ted.2005.854267
File:
PDF, 1.57 MB
english, 2005
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