A wafer-scale 3-D circuit integration technology

Burns, J.A., Aull, B.F., Chen, C.K., Chang-Lee Chen, Keast, C.L., Knecht, J.M., Suntharalingam, V., Warner, K., Wyatt, P.W., Yost, D.-R.W.

How much do you like this book?

What’s the quality of the file?

Download the book for quality assessment

What’s the quality of the downloaded files?

Volume:

Year:

2006

Language:

english

Pages:

DOI:

10.1109/ted.2006.882043

File:

PDF, 1.11 MB

english, 2006

Conversion to is in progress

Conversion to is failed