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Improving Reliability of Copper Dual-Damascene Interconnects by Impurity Doping and Interface Strengthening
Tada, M., Abe, M., Furutake, N., Ito, F., Tonegawa, T., Sekine, M., Hayashi, Y.Volume:
54
Year:
2007
Language:
english
Pages:
11
DOI:
10.1109/ted.2007.901265
File:
PDF, 1.61 MB
english, 2007