A Nondestructive Method of Extracting the Width and...

A Nondestructive Method of Extracting the Width and Thickness of Interconnects for a 40-nm Technology

Mao-Chyuan Tang, Chin-Chuan Cheng, Meng-Fan Wang, Chen, D.C., Chune-Sin Yeh, Michael Yeh, Annie Kuo, Shan-Chieh Chien
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Volume:
56
Year:
2009
Language:
english
Pages:
6
DOI:
10.1109/ted.2009.2026833
File:
PDF, 443 KB
english, 2009
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