A Nondestructive Method of Extracting the Width and Thickness of Interconnects for a 40-nm Technology
Mao-Chyuan Tang, Chin-Chuan Cheng, Meng-Fan Wang, Chen, D.C., Chune-Sin Yeh, Michael Yeh, Annie Kuo, Shan-Chieh ChienVolume:
56
Year:
2009
Language:
english
Pages:
6
DOI:
10.1109/ted.2009.2026833
File:
PDF, 443 KB
english, 2009