Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap Structures
Scogna, A.C., Orlandi, A., Ricchiuti, V.Volume:
52
Year:
2010
Language:
english
Pages:
8
DOI:
10.1109/temc.2009.2027125
File:
PDF, 1.14 MB
english, 2010