Overview of Power Integrity Solutions on Package and PCB:...

IEEE Transactions on Electromagnetic Compatibility 2010 Vol. 52; Iss. 2

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

Tzong-Lin Wu, Hao-Hsiang Chuang, Ting-Kuang Wang
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Volume:
52
Year:
2010
Language:
english
Pages:
11
DOI:
10.1109/temc.2009.2039575
File:
PDF, 978 KB
english, 2010
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