Signal/Power Integrity Modeling of High-Speed Memory Modules Using Chip-Package-Board Coanalysis
Hao-Hsiang Chuang, Wei-Da Guo, Yu-Hsiang Lin, Hsin-Shu Chen, Yi-Chang Lu, Yung-Shou Cheng, Ming-Zhang Hong, Chun-Huang Yu, Wen-Chang Cheng, Yen-Ping Chou, Chuan-Jen Chang, Ku, J., Tzong-Lin Wu, Ruey-BVolume:
52
Year:
2010
Language:
english
Pages:
11
DOI:
10.1109/temc.2010.2043108
File:
PDF, 1.12 MB
english, 2010