Microstructure Evolution of NiFe–Cu Deposited by...

IEEE Transactions on Magnetics 2007 Vol. 43; Iss. 6

Microstructure Evolution of NiFe–Cu Deposited by Electroplating Under an Applied Field

Yi, J.B., Li, X.P., Ding, J., Yin, J.H., Thongmee, S., Seet, H.L.
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Volume:
43
Year:
2007
Language:
english
Pages:
3
DOI:
10.1109/tmag.2007.893416
File:
PDF, 275 KB
english, 2007
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