Analytical Evaluation of Via-Plate Capacitance for...

IEEE Transactions on Microwave Theory and Techniques 2008 Vol. 56; Iss. 9

Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

Yaojiang Zhang, Fan, J., Selli, G., Cocchini, M., de Paulis, F.
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Volume:
56
Year:
2008
Language:
english
Pages:
11
DOI:
10.1109/tmtt.2008.2002237
File:
PDF, 1.61 MB
english, 2008
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