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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - A new physical model for life time prediction of Pb-free solder joints in electromigration tests
Tian, Tian, Gusak, A. M., Liashenko, O. Yu., Han, Jung-Kyu, Choi, Daechul, Tu, King-NingYear:
2012
Language:
english
Pages:
6
DOI:
10.1109/ectc.2012.6248915
File:
PDF, 1.18 MB
english, 2012