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Simulation of photoacoustic imaging of microcracks in silicon wafers using a structure-changeable multilayered thermal diffusion model
Nakata, Toshihiko, Kitamori, Takehiko, Sawada, TsuguoVolume:
46
Year:
2007
Language:
english
Journal:
ao/46/7/ao-46-7-1019.pdf
DOI:
10.1364/AO.46.001019
File:
PDF, 1.21 MB
english, 2007