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Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove for photonic packaging
Uddin, M.A., Hau Ping Chan, Tsun, T.O., Chan, Y.C.Volume:
24
Year:
2006
Language:
english
Pages:
8
Journal:
jlt/24/3/jlt-24-3-1342.pdf
DOI:
10.1109/JLT.2005.863329
File:
PDF, 866 KB
english, 2006