Microhole machining of silicon wafer in air and under deionized water by pulsed UV laser system
Hsiao, Wen-Tse, Tseng, Shih-Feng, Huang, Kuo-Cheng, Chiang, Donyau, Chen, Ming-FeiVolume:
110
Language:
english
Pages:
6
Journal:
Applied Physics A
DOI:
10.1007/s00339-012-7128-7
Date:
March, 2013
File:
PDF, 825 KB
english, 2013