A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module
Puqi Ning, Lei, T.G., Fei Wang, Guo-Quan Lu, Ngo, K.D.T., Rajashekara, K.Volume:
25
Year:
2010
Language:
english
Pages:
9
DOI:
10.1109/tpel.2010.2046498
File:
PDF, 709 KB
english, 2010