[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Measured by Nanoindentation
Yang, Ping-Feng, Lai, Yi-Shao, Jian, Sheng-Rui, Chen, JiunnYear:
2007
Language:
english
Pages:
5
DOI:
10.1109/icept.2007.4441421
File:
PDF, 1.24 MB
english, 2007