[IEEE 2011 6th International Microsystems, Packaging,...

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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Performance of shrouded pin-fin and plate-fin heat sinks with a concentrated heat source

Shyu, Jin-Cherng, Lai, Ying-Hui
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Year:
2011
Language:
english
Pages:
4
DOI:
10.1109/impact.2011.6117270
File:
PDF, 705 KB
english, 2011
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