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[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - The availability of the thermal resistance model in flip-chip packages
Woong Sun Lee,, Kwang Yoo Byun,Year:
2007
Language:
english
Pages:
5
DOI:
10.1109/emap.2007.4510327
File:
PDF, 4.47 MB
english, 2007