[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Through silicon via (TSV) equalizer
Kim, Joohee, Song, Eakhwan, Cho, Jeonghyeon, Pak, Jim So, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Kim, JounghoYear:
2009
Language:
english
Pages:
4
DOI:
10.1109/epeps.2009.5338488
File:
PDF, 704 KB
english, 2009