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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Solution for the Board Level Drop Test in Vertical Direction of BGA Package under Ultrahigh Acceleration
Chen, Zhaoyi, Qi, Bo, Wang, Jiaji, Lee, TaekooYear:
2006
Language:
english
Pages:
5
DOI:
10.1109/icept.2006.359791
File:
PDF, 4.57 MB
english, 2006