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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Fine-line structuring of microwave components on LTCC substrates
Stopel, D., Drue, K.-H., Humbla, S., Mach, M., Mache, T., Rebs, A., Reppe, G., Vogt, G., Hein, M., Muller, J.Year:
2010
Language:
english
Pages:
6
DOI:
10.1109/estc.2010.5642924
File:
PDF, 1.14 MB
english, 2010