[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Investigation on the efficiency of thermal relief shapes on different Printed Circuit Boards
Plotog, Ioan, Varzaru, Gaudentiu, Bunea, Radu, Busu, Iulian, Cucu, Traian, Svasta, PaulYear:
2010
Language:
english
Pages:
4
DOI:
10.1109/siitme.2010.5650836
File:
PDF, 1.52 MB
english, 2010