A Wafer-Level Vacuum Package Using Glass-Reflowed Silicon Through-Wafer Interconnection for Nano/Micro Devices
Jin, Joo-Young, Yoo, Seung-Hyun, Yoo, Byung-Wook, Kim, Yong-KweonVolume:
12
Language:
english
Pages:
11
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2012.6353
Date:
July, 2012
File:
PDF, 2.93 MB
english, 2012