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[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - An over-12-Gbps on-chip transmission line interconnect with a pre-emphasis technique in 90 nm CMOS
Kazuya Miyashita,, Ishii, Takahiro, Ito, Hiroyuki, Noboru Ishihara,, Kazuya Masu,Year:
2008
Language:
english
Pages:
4
DOI:
10.1109/epep.2008.4675940
File:
PDF, 1.99 MB
english, 2008