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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Low-K Interconnect Stack with Thick Metal 9 Redistribution Layer and Cu Die Bump for 45nm High Volume Manufacturing
Ingerly, D., Agraharam, S., Becher, D., Chikarmane, V., Fischer, K., Grover, R., Goodner, M., Haight, S., He, J., Ibrahim, T., Joshi, S., Kothari, H., Lee, K., Lin, Y., Litteken, C., Liu, H., Mays, E.Year:
2008
Language:
english
Pages:
3
DOI:
10.1109/iitc.2008.4546971
File:
PDF, 650 KB
english, 2008