![](/img/cover-not-exists.png)
[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Electromigration behavior of 3D-IC TSV interconnects
Frank, Thomas, Moreau, Stephane, Chappaz, Cedrick, Arnaud, Lucile, Leduc, Patrick, Thuaire, Aurelie, Anghel, LorenaYear:
2012
Language:
english
Pages:
5
DOI:
10.1109/ectc.2012.6248850
File:
PDF, 843 KB
english, 2012