[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Characterization and thermal analysis of packaged AlGaN/GaN power HEMT
Cheng, Stone, Li, Chi-Ying, Liu, Chia-Hung, Chou, Po-ChienYear:
2011
Language:
english
Pages:
3
DOI:
10.1109/impact.2011.6117287
File:
PDF, 1.03 MB
english, 2011