Rapid Thermal Reduction of Inkjet Printed Cu Interconnects on Glass Substrate
Kim, Han-Ki, Jeong, Jin-A, Yoo, In-Kyu, Koo, Jae Bon, Lee, Hyun-Hwi, Hur, Kang-Heon, Kim, Dong-Hoon, Kim, Sung-Eun, Jun, Byung-HoVolume:
14
Year:
2011
Language:
english
Pages:
1
DOI:
10.1149/1.3615825
File:
PDF, 1.21 MB
english, 2011