[IEEE 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC) - Rome, Italy (2008.09.24-2008.09.26)] 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems - Evaluation of an electrical method for detection of die attach imperfections in Smart Power Switches using transient thermal FEM simulations
Kosel, V., Glavanovics, M., Scheikl, E.Year:
2008
Language:
english
Pages:
4
DOI:
10.1109/therminic.2008.4669909
File:
PDF, 2.74 MB
english, 2008