[Advances in Polymer Science] Speciality Polymers/Polymer Physics Volume 88 || Epoxy molding compounds as encapsulation materials for microelectronic devices
Kinjo, NoriyukiVolume:
10.1007/BF
Year:
1989
Language:
english
Pages:
48
DOI:
10.1007/bfb0017963
File:
PDF, 1.54 MB
english, 1989