Thermoelectric measurements for bondability analysis of...

Surface and Interface Analysis 1999 / 08 Vol. 28; Iss. 1

Thermoelectric measurements for bondability analysis of bond pads: a new concept for a bondability analyser

Gröning, P., Schwaller, P., Schneuwly, A., Schlapbach, L.
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Volume:
28
Language:
english
Pages:
4
Journal:
Surface and Interface Analysis
DOI:
10.1002/(sici)1096-9918(199908)28:13.0.co;2-#
Date:
August, 1999
File:
PDF, 404 KB
english, 1999
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