Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects
Kuo-Chung Hsu, Dung-Ching Perng, Jia-Bin Yeh, Yi-Chun WangVolume:
258
Year:
2012
Language:
english
Pages:
7231
DOI:
10.1016/j.apsusc.2012.04.046
File:
PDF, 1.30 MB
english, 2012