Release of interfacial thermal stress and accompanying...

Release of interfacial thermal stress and accompanying improvement of interfacial adhesion in carbon fiber reinforced epoxy resin composites: Induced by diblock copolymers

Shuanghui Deng, Xiaodong Zhou, Chuanjie Fan, Qunfang Lin, Xinggui Zhou
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Volume:
43
Year:
2012
Language:
english
Pages:
997
DOI:
10.1016/j.compositesa.2012.01.004
File:
PDF, 920 KB
english, 2012
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