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Formation and morphology of the intermetallic compounds formed at the 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface
Moo-Chin Wang, Shan-Pu Yu, Tao-Chih Chang, Min-Hsiung HonVolume:
389
Year:
2005
Language:
english
DOI:
10.1016/j.jallcom.2004.08.009
File:
PDF, 367 KB
english, 2005