Control of compound forming reaction at the interface...

Journal of Alloys and Compounds 2005 Vol. 392; Iss. 1-2

Control of compound forming reaction at the interface between SnZn solder and Cu substrate

Tetsu Ichitsubo, Eiichiro Matsubara, Kozo Fujiwara, Masahiko Yamaguchi, Hisao Irie, Seishi Kumamoto, Takaaki Anada
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Volume:
392
Year:
2005
Language:
english
DOI:
10.1016/j.jallcom.2004.09.043
File:
PDF, 491 KB
english, 2005
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