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Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn–Cu/Ni solder joint
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo JungVolume:
415
Year:
2006
Language:
english
DOI:
10.1016/j.jallcom.2005.03.124
File:
PDF, 736 KB
english, 2006