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Coupling effects at Cu(Ni)–SnAgCu–Cu(Ni) sandwich solder joint during isothermal aging
Yanghua Xia, Xiaoming Xie, Chuanyan Lu, Junling ChangVolume:
417
Year:
2006
Language:
english
DOI:
10.1016/j.jallcom.2005.09.051
File:
PDF, 530 KB
english, 2006