Investigation of stress exponent in the room-temperature...

Journal of Alloys and Compounds 2007 Vol. 429; Iss. 1-2

Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

R. Mahmudi, A. Rezaee-Bazzaz, H.R. Banaie-Fard
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Volume:
429
Year:
2007
Language:
english
DOI:
10.1016/j.jallcom.2006.04.037
File:
PDF, 764 KB
english, 2007
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