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Intermetallic compound formation at Sn–3.0Ag–0.5Cu–1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions
Feng-Jiang Wang, Zhi-Shui Yu, Kai QiVolume:
438
Year:
2007
Language:
english
DOI:
10.1016/j.jallcom.2006.08.012
File:
PDF, 1.16 MB
english, 2007