Resonant characteristics of the microelectronic Sn–Cu...

Journal of Alloys and Compounds 2008 Vol. 457; Iss. 1-2

Resonant characteristics of the microelectronic Sn–Cu solder

Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Nien-Ting He
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Volume:
457
Year:
2008
Language:
english
DOI:
10.1016/j.jallcom.2007.03.026
File:
PDF, 1.89 MB
english, 2008
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