Microstructures of eutectic Sn–Ag–Zn solder solidified with...

Microstructures of eutectic Sn–Ag–Zn solder solidified with different cooling rates

C. Wei, Y.C. Liu, Y.J. Han, J.B. Wan, K. Yang
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Volume:
464
Year:
2008
Language:
english
DOI:
10.1016/j.jallcom.2007.09.103
File:
PDF, 1.10 MB
english, 2008
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