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Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples
Jie Zhao, Cong-qian Cheng, Lin Qi, Cheng-yu ChiVolume:
473
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2008.05.082
File:
PDF, 2.48 MB
english, 2009