Interfacial reactions between Sn–9Zn + Cu...

Journal of Alloys and Compounds 2009 Vol. 479; Iss. 1-2

Interfacial reactions between Sn–9Zn + Cu lead-free solders and the Au substrate

Wei-kai Liou, Yee-wen Yen, Kuen-da Chen
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Volume:
479
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2008.12.141
File:
PDF, 1.01 MB
english, 2009
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