Interfacial reactions between Sn–8Zn–3Bi–xAg lead-free solders and Cu substrate
Lijuan Liu, Wei Zhou, Baoling Li, Ping WuVolume:
482
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2009.04.003
File:
PDF, 4.35 MB
english, 2009