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Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
Yulai Gao, Changdong Zou, Bin Yang, Qijie Zhai, Johan Liu, Evgeny Zhuravlev, Christoph SchickVolume:
484
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2009.05.042
File:
PDF, 1.03 MB
english, 2009